Integrated Interconnect Technologies for 3D Nanoelectronic Systems Cover

Integrated Interconnect Technologies for 3D Nanoelectronic Systems

ISBN/ASIN: 1596932465,9781596932463 | 2008 | English | pdf | 528/551 pages | 12.8 Mb
Publisher: Artech House | Author: Muhannad S. Bakir, James D. Meindl

Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.

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Category: Engineering

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